Factory Lead Time  

6 Weeks

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

4-UFBGA, DSBGA

Contact Plating  

Copper, Silver, Tin

Number of Pins  

4

Transistor Element Material  

SILICON

Number of Elements  

1

Power Dissipation (Max)  

1.2W Ta

Current - Continuous Drain (Id) @ 25℃  

1.6A Ta

Drive Voltage (Max Rds On, Min Rds On)  

1.8V 4.5V

Turn Off Delay Time  

14.4 ns

Voltage - Gate Threshold (Vgs(th)) (Max) @ Id  

1.1V @ 250μA

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Series  

NexFET™

JESD-609 Code  

e1

Pbfree Code  

yes

Part Status  

ACTIVE (Last Updated: 5 days ago)

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

4

ECCN Code  

EAR99

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

260

Time@Peak Reflow Temperature-Max (s)  

NOT SPECIFIED

Base Part Number  

CSD13201

Number of Channels  

1

Element Configuration  

Single

Operating Mode  

ENHANCEMENT MODE

Power Dissipation  

1.2W

Turn On Delay Time  

3.9 ns

FET Type  

N-Channel

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

34m Ω @ 1A, 4.5V

Input Capacitance (Ciss) (Max) @ Vds  

462pF @ 6V

Gate Charge (Qg) (Max) @ Vgs  

2.9nC @ 4.5V

Rise Time  

5.9ns

Vgs (Max)  

±8V

Fall Time (Typ)  

9.7 ns

Continuous Drain Current (ID)  

1.6A

Gate to Source Voltage (Vgs)  

8V

Drain-source On Resistance-Max  

0.053Ohm

Drain to Source Breakdown Voltage  

12V

Pulsed Drain Current-Max (IDM)  

20.2A

Feedback Cap-Max (Crss)  

22.6 pF

Length  

0m

Height  

625μm

Width  

0m

Thickness  

650μm

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free